Our business is not affected by this earthquake. Exhibition at SEMICON China 2018 (Mar. “We see DISCO as an emerging leader in the ediscovery market and look forward to how they can continue to meet our growing demands,” said Jim Rosenthal, Director of Litigation Services for AmLaw 200 firm Manatt, Phelps & Phillips LLP. Want to stay up-to-date on the latest features in DISCO, upcoming 20-22). Earthquake update: Aomori prefecture, Japan (January 11). 25-27). Will be displayed at SEMICON China Will be displayed at SEMICON Singapore 2011 has been added. Complete your Illinois Speed Press collection. There is no impact on our business as a result of the earthquake that occurred in eastern Taiwan on August 8. Legal technology leader DISCO today announced its selection as a firmwide ediscovery partner by Touchstone, Bernays, Johnston, Beall, Smith & Stollenwerck, LLP (Touchstone Bernays), one of the leading defense litigation firms in Texas. Free Security for Android Legal technology leader DISCO today announced a significant update to DISCO Analytics Suite that transforms how artificial intelligence (AI) can be leveraged across all of an organization’s cases. Earthquake update: Tokyo, Japan (May 5, 2014) Our business is not affected by this earthquake. Will be displayed at ECTC(Electronic Components and Technology Conference) 2010 has been added. Typhoon update: Our business is not affected by Typhoon Trami. To learn more, visit our. By clicking “I accept” on this banner or using our site, you consent to the use of cookies. Earthquake update: Tochigi Prefecture, Japan (September 3, 2014) Our business is not affected by this earthquake. There has been no effect by Typhoon Haiyan on our business. Our business is not affected by this earthquake. Legal Exhibition at SEMICON Korea 2018 (Jan. 31 - Feb. 2), Exhibition at 47th NEPCON JAPAN (Jan. 17-19). Kansas’ largest law firm, Foulston Siefkin LLP, today announced its selection of legal technology leader DISCO for ediscovery firmwide. Our business is not affected by this earthquake. DISCO's clean, seamless, and intuitive user interface with customisable workflows, views, and security gives you control over your data. Our business is not affected by this earthquake. Earthquake update: Hokkaido pref, Japan (June 4) Our business is not affected by this earthquake. Earthquake update: Kumamoto Prefecture, Japan (Jan 3). This brings the total investment in DISCO to more than $50M. Typhoon update: Our business is not affected by Typhoon JONGDARI. Our business is not affected by this earthquake. Tyson Baber, a partner at Georgian Partners, joined DISCO’s board of directors. Free Security for iPhone/iPad, What is endpoint protection? 2010 has been added. To meet the needs of its growing North American business and to extend its support of Canadian matters, legal technology leader DISCO today announced the availability of its cloud-based ediscovery solution through the Amazon Web Services (AWS) Toronto data center. We use cookies to deliver the best possible experience on our website. Earthquake update: Aomori Prefecture, Japan (Dec 19). “DISCO combines world-class engineering with a deep love and respect for the law to deliver the best legal technology possible. 2 Developed to Promote Post-Process Automation, DFG8640, Fully Automatic Grinder Compatible with ø8-inch wafers, achieves high precision processing of difficult-to-grind materials, Improved Process Adaptability Development of DFD6363, Fully-Automatic Blade Dicing Saw for Φ300 mm Wafers, Effects of Typhoon Jebi (Third Announcement), Information Regarding Earthquake in Hokkaido and Customer Support Contact Information, Effects of Typhoon Jebi (Second Announcement), Effects of Typhoon Jebi (First Announcement), DISCO HI-TEC TAIWAN (Kaohsiung Office) Operations Resumed, DISCO HI-TEC TAIWAN (Kaohsiung Offices) Closed due to Effects of Heavy Rain, Effects of Heavy Rain in Western Japan on DISCO’s Business(Final Announcement) Production System Almost Completely Recovered, Effects of Heavy Rain in Western Japan on DISCO’s Business (Tenth Announcement) Regarding the Delivery Status of Shipments on July 12 and Future Shipment, DISCO HI-TEC TAIWAN (Taipei and Hsinchu Offices) Resumed, Effects of Heavy Rain in Western Japan on DISCO’s Business (Ninth Announcement)Production Status as of July 12, Effects of Heavy Rain in Western Japan on DISCO’s Business (Eighth Announcement) Regarding Delivery Status, Effects of Heavy Rain in Western Japan on DISCO’s Business (Seventh Announcement) Regarding Delivery Status, Effects of Heavy Rain in Western Japan on DISCO’s Business (Sixth Announcement) Regarding Production as of July 11, DISCO HI-TEC TAIWAN (Taipei and Hsinchu Offices) Closed Due to Typhoon Maria, Effects of Heavy Rain in Western Japan on DISCO's Business (Fifth Announcement): Regarding Delivery and Production, Effects of Heavy Rain in Western Japan on DISCO's Business (Fourth Announcement): Regarding Material Procurement, DISCO HI-TEC TAIWAN Offices Closed due to Typhoon Maria, Effects of Heavy Rain in Western Japan on DISCO's Business (Third Announcement):Notice Regarding Water for Production, Effects of Heavy Rain in Western Japan on DISCO's Business (Second Announcement):Notice of Alternate Logistics Route, Effects of Heavy Rain in Western Japan on DISCO's Business (First Announcement):Effects on Production and Expected Delivery Delays, Effects of Heavy Rain in Western Japan on DISCO's Business (Initial Announcement):Confirming the Effects on Shipping, The earthquake that occurred in Northern Osaka on June 18 has had no impact on DISCO’s operations (Second Report), Effects of the Earthquake that Occurred in Northern Osaka on June 18, Notification of Subsidiary Transfer (Transfer of Shares), Operations Started at Nagano Works Chino Plant, DISCO Corporation Receives Intel's Prestigious Supplier Continuous Quality Improvement Award, New Kyushu Branch Building Construction Completion and Relocation, KABRA!zen Developed: Full-Automatization of KABRA Laser Slicing Technology, Newly Developed Fully Automatic Expander DFX2400 which Supports ø300 mm Wafers and Improves Separation Performance of Small Die Devices, Newly Developed Parallel Processing Transfer System which Realizes Efficient Wafer Processing, DFL7362: Stealth Dicing Laser Saw which Achieves Higher Throughput, The website regarding SEMICON Japan 2017 has been released, DFD6561: Newly Developed Small-Footprint, Fully-Automatic Dicing Saw which Supports ø300 mm Wafers, Two Types of New Precision Processing Tools which Support Thinning for Advanced Semiconductor Devices.